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By Hasegawa F., Hashima M., Kanda Sh.

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For fine pitch applications, minor variations in the anvil position may have adverse effects on the final lead configuration. Fixed dies generally produce consistent lead forms for a longer period of time. Fixed dies appear less sensitive to variation in packaging changes (part variations). , so only the part lead is in contact with the board and the part body is off - MIL-tiDBK-2000 4JULY 1990 —. the board). Consistent lead forming is especially critical in applications that use vapor phase reflow applications that use reflowed solder deposition rather than printed solder paste.

MIL-STD-750. Method 2026, antiMIL-STD-883, Me~hod 2003, are tests used to determine the acceptability of wires and component leads. In MIL-STD-202 parts are steam aged, then the leads are dipped in Type R flux and then dipped in a solder pot set at 245°C (473”F) for five seconds. The less active flux and lower solder temperature than normal soldering conditions make the test more sensitive to solderability problems than the soldering process. 95% coverage of the lead indicates acceptable solderability.

3 Lighting. When selecting light sources for use during inspection, the color spectrum should be evaluated to ensure inspectors are able to see untinned copper. A good red spectrum is needed to spot bare copper. Fluorescent lights, projecting a white light with a large blue spectrum, are generally not as effective as incandescent lamps for spotting bare copper. New “warm” fluorescent light systems, however, are being developed with a greater red spectrum and may be successfully used. Ifithinreasonable limits, small pitch inspection and operation is easier to perform with brighter light sources.

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